PCBA solutions
Your trusted partner for demanding PCB Assembly services
With 45 years of experience in electronics assembly, Assel is a trusted partner in Printed Circuit Board Assembly (PCBA) in Europe for Customers who require high level of reliability supported by proactive customer service. Our predominant emphasis is on high-mix, medium & low volume series, with a focus on demanding applications that require comprehensive range of assembly capabilities, as well as inspection and testing processes backed by strong engineering support.
Efficiency and Quality
With the use of latest technology, state-of-art SMT equipment and a flexible line set up suitable for both high mix, as well as serial production, we are able to place 600,000 cph (components per hours). Each SMT line is equipped with both a 3D SPI & 3D AOI inspection, ensuring that 100% of all PCBA’s are inspected. Our most advanced lines additionally include pre-reflow AOI, ensuring even tighter control specifically for high-tech and mission-critical applications.
Product & Process Traceability
With a deployed manufacturing execution system (MES) and automated labelling that supports unique serial numbering, we ensure 100% product traceability, supported by full traceability of the manufacturing process, including test and inspection data. On demand, we provide component traceability down to component batch or even single component if applicable.
In-House PCBA Tooling & Process Improvement
We internally design and build various PCBA assembly tooling, including soldering pallets/carriers (with titanium inserts), as well as various poka-yoke fixtures. This allows continuous improvement of our processes, enhances the quality and repeatability of electronics assembly in all areas.
Turnkey PCB Assembly
PCB Assembly Europe with the technology and supportive processes of a global contract manufacturer, yet the flexibility level of a small private business - we support you with the newest and wide range of technological expertise.
SMT Assembly:
- Three high-speed/flexible SMT lines: 600,000 cph
- Sophisticated SMT line with 3D SPI and multiple 3D AOI’s systems
- Technology: PoP, pin-in-paste, fine-pitch BGA, 0201 components
- MSD control & history management / ESD Management
- Temperature & humidity control
- Automated labeling
- X-Ray inspection
THT:
- Automated Through-Hole Assembly (Radial),
- Selective Soldering
- Wave soldering (Nitrogen) automated Radial Assembly
- Manual soldering cells & lines
BOX BUILD:
- Material sourcing
- New Product Introduction (NPI)
- Testing and packaging
Leverage our nearly 45 years of experience in electronic assembly services/PCBA service across wide range of industries, in order to drive innovation, achieve higher quality and reach cost efficiencies.
Turnkey PCB Assembly
PCB Assembly Europe with the technology and supportive processes of a global contract manufacturer, yet the flexibility level of a small private business - we support you with the newest and wide range of technological expertise.
SMT Assembly:
- Three high-speed/flexible SMT lines: 600,000 cph
- Sophisticated SMT line with 3D SPI and multiple 3D AOI’s systems
- Technology: PoP, pin-in-paste, fine-pitch BGA, 0201 components
- MSD control & history management / ESD Management
- Temperature & humidity control
- Automated labeling
- X-Ray inspection
THT:
- Automated Through-Hole Assembly (Radial),
- Selective Soldering
- Wave soldering (Nitrogen) automated Radial Assembly
- Manual soldering cells & lines
BOX BUILD:
- Material sourcing
- New Product Introduction (NPI)
- Testing and packaging
Leverage our nearly 45 years of experience in electronic assembly services/PCBA service across wide range of industries, in order to drive innovation, achieve higher quality and reach cost efficiencies.
PCB Assembly process competences:
Traceability
Assel utilizes an in-house developed MES (Manufacturing Execution System) system, that supports:
- 100% Product traceability, supported by full traceability of the Process, including test data
- Full material traceability on demand, including manufacturer batch and/or single component
- Directly integrated with the ERP system & production equipment, allowing for online data interchange
- Paperless documentation & revision management
- Real-time production execution visibility
Quality & Compliance
Compliance with IPC Class 2 & 3, with IPC-ceritfied in-house trainers.
Certified Quality Systems – we operate based on:
Lead-time Management
Our modified daily run MRP2 loop and planning competences, allow us to minimize electronics assembly material lead-times, cover unexpected additional orders from your Customers, as well as minimise the risks of delays.
Smart Material Management
Automated storage area, allowing for ensured FIFO control.
Automated registration processes, ensuring component MPN control.
Test & Inspection
Our printed circuit board assembly service include inspection & test capabilities:
- Inspection: 100% 3D AOI inspection & 3D SPI inspection, X-Ray
- Test: Functional, In-circuit (ICT), Safety (Burn-in, Hi-Pot) and Environmental (Climate Control / Shock)
- Custom Functional Test Builds for PCBA
Technology
Core Capabilities & Technology
At Assel, we possess the following core technical capabilities. We continously expand our competencies, in order to support our Customers with higher quality level of printed circuit board assembly (PCBA), box build, systems integration and supporting services.
- Standards: Production in accordance with international standards, IPC Class 2 & 3
- SMT: software controlled, high-speed SMT Assembly lines (01005) inc. PoP, pin-in-paste, fine-pitch BGA
- THT: automated Through-Hole Assembly - Wave Soldering (Nitrogen) & Manual Soldering
- Coating: automated Conformal Coating with AOI inspection
- Test: FCT test development and variety of testing methods, incl. ICT, Safety, Environmental
- Inspection: Inline 3D AOI, inline 3D SPI inspection, 3D X-Ray
- Quality Control: Incoming inspection & in-process measurements
-
Pick & Place
Pick & Place Technical Capabilities
- High-speed, software controlled pick&place machines
- YoM: 2016 or higher
Pick & Place:
- From 01005 compnent size
- From 12 Pitch
- BGA and Mini BGA
- Pin In Paste
- PoP – package on package
- Stack (MA) Matrix Tray
- Paste & Glue
Reflow:
- 2 Sided SMT Reflow
- Nitrogen SMD Reflow
- High temperature
- Pb and Pb free
-
Soldering
Soldering Technical Capabilities
Screen Printing:
- Step Stencil (Cross Over)
- Pb and Pb free
Soldering:
- No Clean Process
- Lead Free Hi Temperature
- Nitrogen Wave
- Spray Flux Application
- Nitrogen Reflow
- Soldering Point
- Manual Soldering
- Pb and Pb free
-
Inspection & Test
Inspection & Test Capabilities
Inspection:
- 3D Solder Paste Inspection (SPI)
- 3D Automated Optical Inspection (AOI)
- Advanced X-Ray inspectionfor BGA/QFN packages
- Cross Section
- Manual Visual Inspection
Test:
- Functional Testing (FCT
- In-circuit test (ICT)
- Enviornmental tests (Thermal Shock Chamber)
- Burn-In Test
- High Voltage Test
- Stress Test
- Strain tests
- Leakage tests
-
Conformal Coating & Potting
Conformal Coating & Potting
- Professionalcleaning and washing of assembled PCBs
- Conformal Coating:
- ASYMTEK Select Coat® SL-940 Series conformal coating system for inline production
- Film coater SC-104 with rotate options
- Precision head available
- Laser Fan Width Control
- UV system control
- Curing
- Potting:
- 2 applications valid for two different compounds
- Repeatable process: electronically controlled dozing
- Different types of materials (Epoxy, Polyurethane, Silicones)
- Underfill
-
General Technology
General Capabilities
- Software:
- Manufacturing Execution System (MES) - incl. traceability
- Production Planning integrated with MES and ERP
- Documentation Management: M-Files
- ERP: Microsoft Dynamics AX
- EDI & API information exchange
- Marking: automatic Label & Laser marking systems
- Depanelling: Router / V-cut / Punch
- Production Equipment: Assembly lines & assembly cells design & build
- Milling & Drilling: Working area 740 x 740 x 150 mm
- Problem Solving: Failure Analysis & Troubleshooting
- BGA/LG Rework (balling & reballing)
- Programming: serial Flash programming
- Software:
Technology
-
Pick & Place
Pick & Place Technical Capabilities
- High-speed, software controlled pick&place machines
- YoM: 2016 or higher
Pick & Place:
- From 01005 compnent size
- From 12 Pitch
- BGA and Mini BGA
- Pin In Paste
- PoP – package on package
- Stack (MA) Matrix Tray
- Paste & Glue
Reflow:
- 2 Sided SMT Reflow
- Nitrogen SMD Reflow
- High temperature
- Pb and Pb free
-
Soldering
Soldering Technical Capabilities
Screen Printing:
- Step Stencil (Cross Over)
- Pb and Pb free
Soldering:
- No Clean Process
- Lead Free Hi Temperature
- Nitrogen Wave
- Spray Flux Application
- Nitrogen Reflow
- Soldering Point
- Manual Soldering
- Pb and Pb free
-
Inspection & Test
Inspection & Test Capabilities
Inspection:
- 3D Solder Paste Inspection (SPI)
- 3D Automated Optical Inspection (AOI)
- Advanced X-Ray inspectionfor BGA/QFN packages
- Cross Section
- Manual Visual Inspection
Test:
- Functional Testing (FCT
- In-circuit test (ICT)
- Enviornmental tests (Thermal Shock Chamber)
- Burn-In Test
- High Voltage Test
- Stress Test
- Strain tests
- Leakage tests
-
Conformal Coating & Potting
Conformal Coating & Potting
- Professionalcleaning and washing of assembled PCBs
- Conformal Coating:
- ASYMTEK Select Coat® SL-940 Series conformal coating system for inline production
- Film coater SC-104 with rotate options
- Precision head available
- Laser Fan Width Control
- UV system control
- Curing
- Potting:
- 2 applications valid for two different compounds
- Repeatable process: electronically controlled dozing
- Different types of materials (Epoxy, Polyurethane, Silicones)
- Underfill
-
General Technology
General Capabilities
- Software:
- Manufacturing Execution System (MES) - incl. traceability
- Production Planning integrated with MES and ERP
- Documentation Management: M-Files
- ERP: Microsoft Dynamics AX
- EDI & API information exchange
- Marking: automatic Label & Laser marking systems
- Depanelling: Router / V-cut / Punch
- Production Equipment: Assembly lines & assembly cells design & build
- Milling & Drilling: Working area 740 x 740 x 150 mm
- Problem Solving: Failure Analysis & Troubleshooting
- BGA/LG Rework (balling & reballing)
- Programming: serial Flash programming
- Software:
-
Technology
Core Capabilities & Technology
At Assel, we possess the following core technical capabilities. We continously expand our competencies, in order to support our Customers with higher quality level of printed circuit board assembly (PCBA), box build, systems integration and supporting services.
- Standards: Production in accordance with international standards, IPC Class 2 & 3
- SMT: software controlled, high-speed SMT Assembly lines (01005) inc. PoP, pin-in-paste, fine-pitch BGA
- THT: automated Through-Hole Assembly - Wave Soldering (Nitrogen) & Manual Soldering
- Coating: automated Conformal Coating with AOI inspection
- Test: FCT test development and variety of testing methods, incl. ICT, Safety, Environmental
- Inspection: Inline 3D AOI, inline 3D SPI inspection, 3D X-Ray
- Quality Control: Incoming inspection & in-process measurements
Test Development & Engineering
As a part of our contract electronicsmanufacturing services, we develop and re-engineer functional testers for automated production process of y...
Engineering Support
ENTRUST YOUR PRODUCTS INTO GOOD HANDS Complex electronics assemblies and electro-mechanical integrations deliver endless engineering challenges on ...
